Semiconductor device and test method for the same

Details Semiconductor device and test method for the same Semiconductor device and test method for the same

2005-04-26

2005-04-26

Zarneke, David (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

06885212

ABSTRACT:
A multi-bus semiconductor device and a method of its probing test perform the DC test for individual pads of a device while dealing with an adequate number of devices for simultaneous measurement based on the scheme of input/output pad number compressive test. The semiconductor device includes switch elements SW0-SW4connected between input/output pads P0-P4and a testing line L0so that pads in an arbitrary combination, among the off-probe pads P1-P4that are not made in contact with the tester probe Pr0,are selected for testing in correspondence to the combination of switch elements that are turned on. The input/output buffers of the pads under test are deactivated to block their internal current paths. The corresponding switch elements are turned on to connect the off-probe pads under test to the probe pad P0that is made in contact with the tester probe Pr0,and the leak current of the probes is measured with the tester TS.

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