Semiconductor device and system having semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

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C257S673000, C257S686000, C257S690000, C257S700000, C257S750000, C257S779000

Reexamination Certificate

active

10385919

ABSTRACT:
A ball grid array packaged semiconductor device mounted on a mounting board and including pads formed within a package and are connected to signal lines of a bare chip by bonding wires. There are formed first vias extending from the respective pads to a bottom surface of a package, and second vias extending from the same respective pads to a top surface of the package to form continuous vias. This makes it possible to connect the mounting boards to the top and bottom surfaces of the package, thereby enabling reduction of the wiring density of wiring patterns on the mounting boards, and thereby facilitating routing of the wiring patterns on the mounting boards. The semiconductor device is capable of reducing wiring density of the wiring pattern on the mounting board.

REFERENCES:
patent: 5726493 (1998-03-01), Yamashita et al.
patent: 5828126 (1998-10-01), Thomas
patent: 6392304 (2002-05-01), Butler
patent: 6469374 (2002-10-01), Imoto
patent: 6590291 (2003-07-01), Akagawa
patent: 6603198 (2003-08-01), Akram et al.
patent: 64-050551 (1989-02-01), None
patent: 7-335783 (1995-12-01), None
patent: 8-222690 (1996-08-01), None
patent: 11-168150 (1999-06-01), None
patent: 2002-170906 (2002-06-01), None
Japanese Office Action mailed Jun. 13, 2006, with partial translation.
Japanese Office Action mailed Jun. 13, 2006, with partial translation.

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