Semiconductor device and semiconductor package including the...

Details Semiconductor device and semiconductor package including the... Semiconductor device and semiconductor package including the...

2008-12-31

2011-10-11

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S621000, C257S686000, C257S698000, C257SE23067, C257SE23174

Reexamination Certificate

active

08035194

ABSTRACT:
Provided is a semiconductor device capable of removing a power ground grid noise using a small area. The semiconductor device includes a first chip including at least one decoupling capacitor; and a second semiconductor chip stacked over the first semiconductor chip, including internal circuits.

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Notice of Preliminary Rejection issued from Korean Intellectual Property Office on Sep. 30, 2010.
Notice of Allowance issued from Korean Intellectual Property Office on Feb. 28, 2011.

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