Semiconductor device and semiconductor package having the same

Details Semiconductor device and semiconductor package having the same Semiconductor device and semiconductor package having the same

2010-06-04

2010-12-21

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

Groove

C257S690000, C257SE23002, C257SE23193

Reexamination Certificate

active

07855437

ABSTRACT:
A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.

REFERENCES:
patent: 5874773 (1999-02-01), Terada et al.
patent: 6331729 (2001-12-01), Yusa et al.
patent: 10-144723 (1998-05-01), None
patent: 10-173042 (1998-06-01), None
patent: 2002-329825 (2002-11-01), None
patent: 1020060072967 (2006-06-01), None
USPTO OA mailed Jul. 1, 2009 for parent U.S. Appl. No. 11/852,579.
USPTO OA mailed Aug. 28, 2009 for parent U.S. Appl. No. 11/852,579.

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