Semiconductor device and semiconductor package

Details Semiconductor device and semiconductor package Semiconductor device and semiconductor package

2005-02-15

2005-02-15

Jones, Deborah (Department: 1775)

Active solid-state devices (e.g., transistors, solid-state diode

Organic semiconductor material

C428S620000, C428S308400, C428S318600, C428S319300, C428S319900, C428S500000, C428S521000, C524S575000, C524S423000

Reexamination Certificate

active

06855952

ABSTRACT:
A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating material:where R is a hydrocarbon structure which may have a substituent group or groups, R1is hydrogen, methyl, or ethyl, m is and integer of 1 to 4, and n is an integer of not less than 2. With this, a semiconductor device and a semiconductor package which show excellent transmission characteristics and less power consumption are provided.

REFERENCES:
patent: 5475264 (1995-12-01), Sudo et al.
patent: 6420476 (2002-07-01), Yamada et al.
patent: 20040039127 (2004-02-01), Amou et al.
patent: 11-60519 (1999-03-01), None
patent: 2002-9202 (2002-01-01), None
Prior U.S. Appl. No. 09/951,414, filed Sep. 14, 2001 (Title of the invention: Low Dielectric Loss Tangent Resin Composition, Curable Film and Cured Product, Electrical Part Using the Same and Method for Production Thereof.
“Soluble poly(divinylbenzene): Reaction Mechanism for the Anionic Polymerization of Divinylbenzene with Lithium Diisopropylamide as Catalyst” Makromo.Chem 187,23-37 (1986).
High-Yield Synthesis and Characterization of 1,2-Bis(p-vinylphenyl) Ethane, Li et al., J. Polym.Sci.Part A: Polym.Chem.32,2023-2027(1994).
“Cyclopolymerization of _-BIS (4-Vinylphenyl)-Alkane: Polymer Containing [3.3] Paracyclophane Unit in the Main Chain” Polymer Letters Edition, vol. 14, pp. 85-90 (1976).

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