Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-01-31
2006-01-31
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S723000, C257S686000, C257S685000, C257S784000, C257S786000, C257S698000, C257S734000
Reexamination Certificate
active
06992395
ABSTRACT:
The present invention is directed to a semiconductor device and a semiconductor module both having an inexpensive and compact structure. The semiconductor module (M1) according to a first embodiment of the present invention is comprised of a plurality of semiconductor devices (A1) through (A3) having a structure that includes external connection electrodes (15) and (16) being provided on both the face side and the back side of outer peripheral portions of a printed wiring board (10), and a semiconductor integrated circuit chip (1A) being mounted on a central portion of the printed wiring board (10). The external connection electrodes (15) of the semiconductor devices (A1) and (A3) and the external connection electrodes (16) of the semiconductor device (A2) are electrically connected to each other by solder Sb, for example, either directly or through a chip part (30) or a relay board (40).
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International Search Report dated Jul. 4, 2001.
Kananen Ronald P.
Rader & Fishman & Grauer, PLLC
Sony Corporation
Williams Alexander Oscar
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