Semiconductor device and semiconductor module having...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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C257S723000, C257S686000, C257S685000, C257S784000, C257S786000, C257S698000, C257S734000

Reexamination Certificate

active

06992395

ABSTRACT:
The present invention is directed to a semiconductor device and a semiconductor module both having an inexpensive and compact structure. The semiconductor module (M1) according to a first embodiment of the present invention is comprised of a plurality of semiconductor devices (A1) through (A3) having a structure that includes external connection electrodes (15) and (16) being provided on both the face side and the back side of outer peripheral portions of a printed wiring board (10), and a semiconductor integrated circuit chip (1A) being mounted on a central portion of the printed wiring board (10). The external connection electrodes (15) of the semiconductor devices (A1) and (A3) and the external connection electrodes (16) of the semiconductor device (A2) are electrically connected to each other by solder Sb, for example, either directly or through a chip part (30) or a relay board (40).

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