Semiconductor device and semiconductor device unit having ball-g

Details Semiconductor device and semiconductor device unit having ball-g Semiconductor device and semiconductor device unit having ball-g

1997-02-24

1998-03-10

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257686, 257738, 257717, 257720, 257692, 257777, 257697, H01L 2302, H01L 2940, H01L 2352

Patent

active

057264937

ABSTRACT:
A semiconductor device or a semiconductor device unit having a ball-grid-array type package structure, comprises a semiconductor element, a base having a mounting surface and a connection surface opposite to each other, the semiconductor element being mounted on the mounting surface, a plurality of balls which function as external connection terminals being provided on the connection surface, a sealing resin sealing the semiconductor element, and an electrically conductive electrode member, a first end of the electrode member being electrically connected to the semiconductor element on the mounting surface of the base, a second end of the electrode member being electrically connective to an outer terminal. An electrically conductive pin which can pass through the sealing resin can be used as the electrode member. Even after the semiconductor device is mounted on a circuit board, a test on the semiconductor element can be conducted. Also, a reliability of electric appliances and a heat release efficiency can be improved.

REFERENCES:
patent: 5006922 (1991-04-01), McShane et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5200366 (1993-04-01), Yamada et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5433822 (1995-07-01), Mimura et al.
patent: 5455456 (1995-10-01), Newman
patent: 5468999 (1995-11-01), Lin et al.
patent: 5608265 (1997-03-01), Kitano et al.

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