Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate
2007-03-06
2007-03-06
Ho, Tu-Tu (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
C257S666000, C257SE23043, C257SE23048
Reexamination Certificate
active
11034760
ABSTRACT:
A semiconductor device comprises a semiconductor chip which is mounted on a stage. A plurality of leads are electrically connected with the semiconductor chip. A package encloses the semiconductor chip and a part of the plurality of leads. A first corner lead is provided in the stage and outwardly extends from at least one of vertex portions at four corners of the stage to an exterior of the package.
REFERENCES:
patent: 2002/0140064 (2002-10-01), Wu et al.
patent: 2003/0127711 (2003-07-01), Kawai et al.
patent: 2004/0164408 (2004-08-01), Yang
patent: 2005/0029640 (2005-02-01), Amano et al.
patent: 7-30067 (1995-01-01), None
patent: 9-293822 (1997-11-01), None
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