Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-01-16
2007-01-16
Toledo, Fernando L. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S797000, C438S401000, C438S452000
Reexamination Certificate
active
10929373
ABSTRACT:
In a semiconductor device including a semiconductor wafer having a first main surface where a circuit element is formed, electrode pads are formed at an upper portion of the first main surface of the semiconductor wafer electrically connected with the circuit element. Index marks are formed on a second main surface of the semiconductor wafer that is opposite the first main surface. The index marks consist of line segments and indicate a direction along which the semiconductor device is to be mounted.
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Arai Kentarou
Furuya Yuuki
Iguchi Akihisa
Oki Electric Industry Co. Ltd.
Toledo Fernando L.
VolentineFrancos&Whitt,PLLC
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