Semiconductor device and semiconductor chip for use therein

Details Semiconductor device and semiconductor chip for use therein Semiconductor device and semiconductor chip for use therein

2006-10-24

2006-10-24

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

Reexamination Certificate

active

07126226

ABSTRACT:
A semiconductor device has a first semiconductor chip and a second semiconductor chip superposed on and bonded to the surface of the first semiconductor chip. In the region on the first semiconductor chip where the second semiconductor chip is bonded thereto, connection pads are arranged in positions that fit a plurality of predetermined types of semiconductor chips. On the second semiconductor chip, connection pads are arranged in positions that fit the connection pads arranged on the first semiconductor chip.

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