Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-01-11
2005-01-11
Thomas, Tom (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S110000, C257S700000, C257S723000
Reexamination Certificate
active
06841417
ABSTRACT:
In a semiconductor device, a plurality of linear semiconductors of a predetermined length, on which electronic element are formed, are aligned laterally and in parallel. A semiconductor assembly apparatus for assembling the semiconductor device, aligns the linear semiconductors in parallel via an arranging member. The linear semiconductors are interconnected by a connecting member in the semiconductor assembly apparatus.
REFERENCES:
patent: 5568356 (1996-10-01), Schwartz
patent: 5834843 (1998-11-01), Mori et al.
patent: 6166438 (2000-12-01), Davidson
patent: WO 9825090 (1998-06-01), None
Asahi Kogaku Kogyo Kabushiki Kaisha
Díaz José R.
Pitney Hardin LLP
Thomas Tom
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