Semiconductor device and semiconductor apparatus

Details Semiconductor device and semiconductor apparatus Semiconductor device and semiconductor apparatus

2007-05-08

2007-05-08

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S678000, C257S772000

Reexamination Certificate

active

10975385

ABSTRACT:
A semiconductor device comprises a bonding surface to be mounted with adhesive or solder on a mounting surface of a mounting member. One or more grooves are provided on the bonding surface that extend in a direction substantially parallel to one side surface of the semiconductor device.

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patent: 10-512402 (1998-11-01), None
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T. Brunschwiler, et al., “Hierarchically Nested Channels for Fast Squeezing Interfaces with Reduced Thermal Resistance” Proceedings 2005, Semiconductor Thermal Measurement and Management Symposium, San Jose, CA, USA Mar. 15-17, 2005, pp. 31-38 w/cover sheet.

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