Semiconductor device and radiation detector employing it

Details Semiconductor device and radiation detector employing it Semiconductor device and radiation detector employing it

2004-02-26

2010-02-16

Weiss, Howard (Department: 2814)

Radiant energy

Invisible radiant energy responsive electric signalling

Semiconductor system

C250S370110, C370S902000, C370S902000

Reexamination Certificate

active

07663113

ABSTRACT:
A wiring substrate to which a semiconductor element10is connected, is a wiring substrate20comprised of a glass substrate with through-hole groups20d, each group consisting of a plurality of through holes20c extending from input surface20a to output surface20b and formed in a predetermined array, and conductive members21formed on respective inner walls of the through holes20c in each through-hole group20d so as to establish electrical continuity between input surface20a and output surface20b. A bump electrode12of semiconductor element10connected to the input surface20a corresponds to each through-hole group20d, conductive member21, and conductive part22formed in a region covering the through-hole group20d, and is connected so that a portion of the bump electrode12enters into an interior of each of the through holes20c. This provides a semiconductor device in which good connection is made between the semiconductor element and the corresponding conduction path in the wiring substrate, and a radiation detector using it.

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