Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Reexamination Certificate
2007-09-05
2010-11-16
Gurley, Lynne A (Department: 2811)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
C257S529000, C257S209000, C257SE23149, C257SE27102, C257SE21592, C438S215000, C438S333000, C438S467000, C438S601000
Reexamination Certificate
active
07833844
ABSTRACT:
A disclosed method of producing a semiconductor device includes the steps of (A) forming a gate electrode and a trimming fuse on a semiconductor substrate; (B) forming a side wall insulating film covering the gate electrode and the trimming fuse; (C) forming a conductive film on the side wall insulating film and patterning the conductive film to form an etching stop layer and a resistance element; (D) forming a side wall on the sides of the gate electrode; (E) repeating, one or more times, sub-steps of forming an interlayer insulating film and of forming an upper wiring layer, and then forming a passivation film; (F) removing the passivation film and the interlayer insulating film in the trimming opening forming area until the etching stop layer is exposed; and (G) forming the trimming opening by removing the etching stop layer in the trimming opening forming area.
REFERENCES:
patent: 4628590 (1986-12-01), Udo et al.
patent: 5047826 (1991-09-01), Keller et al.
patent: 5821160 (1998-10-01), Rodriguez et al.
patent: 5972756 (1999-10-01), Kono et al.
patent: 6369409 (2002-04-01), Takasu et al.
patent: 6372652 (2002-04-01), Verma et al.
patent: 6586282 (2003-07-01), Takasu
patent: 2004/0227237 (2004-11-01), Ueda
patent: 2005/0110070 (2005-05-01), Omura
patent: 2007/0007621 (2007-01-01), Omura et al.
patent: 2007/0128790 (2007-06-01), Dainin
patent: 60-44829 (1985-10-01), None
patent: 2001-176976 (2001-06-01), None
patent: 2003-258103 (2003-09-01), None
patent: 2003-264230 (2003-09-01), None
patent: 2004-111420 (2004-04-01), None
patent: 2005-197602 (2005-07-01), None
Cooper & Dunham LLP
Gurley Lynne A
Li Meiya
Ricoh & Company, Ltd.
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