Semiconductor device and process for producing the same, and lea

Details Semiconductor device and process for producing the same, and lea Semiconductor device and process for producing the same, and lea

1992-04-03

1993-08-10

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437215, 437217, H01L 2160

Patent

active

052348660

ABSTRACT:
According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

REFERENCES:
patent: 4264917 (1981-04-01), Ugon
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer
patent: 4812420 (1989-03-01), Matsuda et al.
patent: 4824362 (1989-05-01), Tran et al.
patent: 4837184 (1989-06-01), Lin et al.
patent: 4859632 (1989-08-01), Lumbard
patent: 4937656 (1990-06-01), Kohara

Affiliated with

Also associated with

Rating

Semiconductor device and process for producing the same, and lea does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and process for producing the same, and lea, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and process for producing the same, and lea will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1724949