Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2005-02-08
2005-02-08
Lam, Cathy (Department: 1775)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C264S272110, C264S328140, C264S331120, C525S481000, C528S087000, C528S50200C
Reexamination Certificate
active
06852263
ABSTRACT:
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
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Ito Hisataka
Kuroyanagi Akihisa
Oono Hirofumi
Sudo Shinichirou
Birch Stewart Kolasch & Birch, LLP.
Lam Cathy
Nitto Denko Corporation
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