Semiconductor device and process for producing the same

Details Semiconductor device and process for producing the same Semiconductor device and process for producing the same

2005-09-06

2005-09-06

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S700000, C257S787000, C257S788000

Reexamination Certificate

active

06940161

ABSTRACT:
In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.

REFERENCES:
patent: 5973337 (1999-10-01), Knapp et al.
patent: 6028364 (2000-02-01), Ogino et al.
patent: 6166433 (2000-12-01), Takashima et al.
patent: 6202298 (2001-03-01), Smith
patent: 6281570 (2001-08-01), Kameyama et al.
patent: 6538209 (2003-03-01), Ouchi et al.
patent: 6642083 (2003-11-01), Miyazaki et al.

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