Semiconductor device and process for producing the same

Details Semiconductor device and process for producing the same Semiconductor device and process for producing the same

1987-02-17

1988-08-16

Kucia, R. R.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 16HS, 361387, 437209, 437215, 437221, 437224, H01L 2326

Patent

active

047648040

ABSTRACT:
A semiconductor device having improved heat-dissipating characteristics employs a thin insulator film made of diamond, which has excellent thermal conductivity, as an insulator film which is formed on a chip immediately below a heat-dissipating bump electrode. Since the thin diamond film has excellent insulating properties and high thermal conductivity, it is possible to improve heat-dissipating characteristics of even a high-power semiconductor device such as a multichip module. In the case of, particularly, a multichip module, the insulation between a mother chip and a child chip can also be ensured by the presence of the thin diamond film.

REFERENCES:
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patent: 3761783 (1973-09-01), Kroger et al.
patent: 3922775 (1975-12-01), Potter
patent: 3961103 (1976-06-01), Aisenberg
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patent: 4571447 (1986-02-01), Prins
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patent: 4651192 (1987-03-01), Matshshita et al.
patent: 4703339 (1987-10-01), Matsuo
Loeffel et al., Heat Transfer Apparatus for Semiconductor Chip, IBM Tech. Disc. Bull., V. 21, #6, Nov. 1978, p. 2430 relied on.

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