Semiconductor device and process for producing same

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

29588, 72347, 72353, 72478, 357 74, H01L 2304

Patent

active

046044957

ABSTRACT:
A ceramic-type semiconductor package including a semiconductor pellet, a ceramic lead base having a cavity for accommodating the pellet, and a metal cap for sealing the cavity. The cavity is upward opened, and the metal cap has a central depressed portion to be inserted into the cavity. The central depressed portion has a bottom wall which has a faceted surface.
Also, a process for producing a ceramic-type semiconductor package including the steps of providing a semiconductor pellet, providing a ceramic lead base having an upward opened cavity for accommodating the semiconductor pellet, placing the semiconductor pellet in the cavity of the ceramic lead base, pressing a flat metal plate between a male die and a female die, whereby a metal cap having a central depressed portion is produced, inserting the central depressed portion of the metal cap into the cavity of the ceramic lead base, and sealing the peripheral flat portion of the metal cap with a sealing frame bonded on the ceramic lead base. The male die has a faceted surface. The central depressed portion has a bottom wall which has a faceted surface.

REFERENCES:
patent: 3767839 (1973-10-01), Beal

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