Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-06-06
2006-06-06
Graybill, David E. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000, C257S783000
Reexamination Certificate
active
07057265
ABSTRACT:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
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Kageyama Akira
Kaneda Aizou
Kikuchi Tooru
Maekawa Iwao
Masuko Takashi
Graybill David E.
Griffin & Szipl, P.C.
Hitachi Chemical Co. Ltd.
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