Semiconductor device and process for fabrication thereof

Details Semiconductor device and process for fabrication thereof Semiconductor device and process for fabrication thereof

2005-02-15

2005-02-15

Pert, Evan (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S118000, C438S126000

Reexamination Certificate

active

06855579

ABSTRACT:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

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