Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2008-06-17
2008-06-17
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S127000, C257SE23116, C257SE21499, C257SE21502, C257SE21519
Reexamination Certificate
active
07387914
ABSTRACT:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
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Kageyama Akira
Kaneda Aizou
Kikuchi Tooru
Maekawa Iwao
Masuko Takashi
Geyer Scott B.
Griffin & Szipl, P.C.
Hitachi Chemical Company Ltd.
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