Semiconductor device and package

Details Semiconductor device and package Semiconductor device and package

1989-09-11

1992-02-25

James, Andrew J.

357 80, 357 65, 357 72, H01L 2302

Patent

active

050917722

ABSTRACT:
A package body for accommodating a semiconductor chip includes a plurality of inner-electrodes disposed on the package body and arranged in a multiplicity of rows around the semiconductor chip and outer-electrodes in the package body electrically connected to the corresponding inner-electrodes. The package body includes support sections disposed on the package body between the rows of inner-electrodes for supporting metal wires which connect the inner-electrodes to the electrodes of the semiconductor chip. A conductive layer for diminishing the floating capacitance between the metal wires may be included in the support sections.

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