Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
1998-11-30
2001-12-11
Graybill, David E. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S730000, C257S787000
Reexamination Certificate
active
06329711
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to devices having a resin package such as semiconductor devices, and more particularly to a resin-sealed semiconductor device of a leadless surface mounting type directed to high-density mounting. Further, the present invention is concerned with a method of producing such a semiconductor device.
Recently, down-sizing of electronic devices has required a decrease in the pitch of leads extending from a resin-sealed type package. Hence, it is desired that there are provided a new structure of the resin-sealed type package making it possible to further decrease the lead pitch and a method of producing such a structure.
2. Description of the Related Art
FIGS. 1A
,
1
B and
1
C are diagrams of a semiconductor device having a conventional resin-sealed package. The device includes a resin
1
, a chip
2
, outer leads
3
, bonding wires
4
made of an alloy of gold and aluminum (Au—Al), and a die pad
5
. The package shown in
FIGS. 1A
,
1
B and
1
C is called an SSOP (Shrink Small Outline Package). The outer leads
3
are bent in a gull-wing shape, and are mounted on a circuit board.
FIG. 2
is a cross-sectional view of a semiconductor device of another type. The device shown in
FIG. 2
includes solder balls
6
and a mount base
7
on which the chip
2
sealed by the resin
1
and solder balls
6
are provided. The package shown in
FIG. 2
is called a BGA (Ball Grid Array) type, and the solder balls
6
serve as terminals provided on the mount base
7
.
The SSOP type package shown in
FIGS. 1A
,
1
B and
1
C has a disadvantage in which a large area
9
is needed to arrange inner leads
8
integrally formed with the outer leads
3
, and a large area is needed to arrange the outer leads
3
. Hence, the SSOP type package needs a large mounting area.
The BGA type package shown in
FIG. 2
is expensive because it needs the mount base
7
.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a semiconductor device and a mounting structure having a reduced size and an increased number of terminals for external connections.
The above object of the present invention is achieved by a semiconductor device comprising: a semiconductor element; a resin package sealing the semiconductor element; resin projections protruding from a mounting surface of the resin package; metallic film parts provided to the resin projections; connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts; and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads. Hence, the connecting members are not bonded to the bottom surfaces of the metallic film parts but are bonded to the connection pads. Hence, the size of the metallic film parts can be reduced. Hence, it is possible to reduce the pitch at which the metallic film parts are arranged and provide the metallic film parts to the resin package at a high density. In addition, the connection pads are in contact with the resin package and thus have an anchor effect to the resin package. Hence, it is possible to prevent the metallic film parts from being broken away from the resin package.
The semiconductor device may be configured so that the connection pads extend from the metallic film parts in parallel with a mounting surface of the semiconductor element.
The semiconductor device may be configured so that the resin projections have one of a cylindrical shape and a conical shape.
The semiconductor device may be configured so that it further comprises: relay pads to which the connecting members are connected; lead lines connecting the relay pads and the metallic film parts; and anchor parts provided in the lead lines and engaging the resin package.
The semiconductor device may be configured so that a surface of the resin package on which the metallic film parts are formed has convex and concave portions.
The semiconductor device may be configured so that it further comprises: relay pads to which the connecting members are connected; element-facing metallic film parts provided to element-facing resin projections located so as to face the semiconductor element; and lead wires connecting the relay pads and the element-facing metallic film parts.
The semiconductor device may be configured so that the metallic film parts are arranged at the same pitch as that at which the electrode pads are arranged on the semiconductor element.
The semiconductor device may be configured so that the connecting members are wires.
The semiconductor device may be configured so that the connecting members are projection electrodes, and the semiconductor element is bonded to the connection pads in a face-down bonding formation.
The semiconductor device may be configured so that it further comprises an under-fill resin provided to a surface of the resin package on which the metallic film parts are formed, the under-fill resin comprising thermosetting resin.
The semiconductor device may be configured so that the connecting pads have a flange shape.
The semiconductor device may be configured so that the connecting pads are integrally formed with the metallic film parts.
The above object of the present invention is also achieved by a mounting structure for mounting, on a board, a semiconductor device including: a semiconductor element; a resin package sealing the semiconductor element; resin projections protruding from a mounting surface of the resin package; metallic film parts provided to the resin projections; connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts; and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads, said mounting structure comprising an under-fill resin that is proved between the semiconductor device and the board and is made of thermosetting resin.
The thermosetting resin may be replaced by thermoplastic resin.
REFERENCES:
patent: 4724280 (1988-02-01), Tsuji et al.
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5502631 (1996-03-01), Adachi
patent: 5521427 (1996-05-01), Chia et al.
patent: 5523628 (1996-06-01), Williams et al.
patent: 5535101 (1996-07-01), Miles et al.
patent: 5567984 (1996-10-01), Zalesinski et al.
patent: 5625230 (1997-04-01), Park et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5633535 (1997-05-01), Chao et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5666008 (1997-09-01), Tomita et al.
patent: 5670826 (1997-09-01), Bessha et al.
patent: 5677575 (1997-10-01), Maeta et al.
patent: 5703406 (1997-12-01), Kang
patent: 5729051 (1998-03-01), Nakamura
patent: 5804881 (1998-09-01), Wille et al.
patent: 5831832 (1998-11-01), Gillette et al.
patent: 5866950 (1999-02-01), Iwasaki et al.
patent: 5874784 (1999-02-01), Aoki et al.
patent: 5877544 (1999-03-01), Rigal et al.
patent: 5894173 (1999-04-01), Jacobs et al.
patent: 5918113 (1999-06-01), Higashi et al.
patent: 5985043 (1999-11-01), Zhou et al.
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 0 638 933 A1 (1995-02-01), None
patent: 0 751 561 A1 (1997-01-01), None
patent: 2 691 836 (1993-12-01), None
patent: 59-208755 (1984-11-01), None
patent: 59-208756 (1984-11-01), None
patent: 61-135131 (1986-06-01), None
patent: 1-161724 (1989-06-01), None
patent: 1-179334 (1989-07-01), None
patent: 2-112264 (1990-04-01), None
patent: 3-94438 (1991-04-01), None
patent: 3-94459 (1991-04-01), None
patent: 3-99456 (1991-04-01), None
patent: 3-178152 (1991-08-01), None
patent: 5-129473 (1993-05-01), None
patent: 5-251455 (1993-09-01), None
patent: 5-299530 (1993-11-01), None
patent: 6-151520 (1994-05-01), None
patent: 6-252334 (1994-09-01), None
patent: 6-310563 (1994-11-01), None
patent: 7-161746 (1995-06-01), None
patent: 7-226475 (1995-08-01), None
patent: 7-23
Hozumi Takashi
Kawahara Toshimi
Monma Syuichi
Nakaseko Shinya
Nomoto Ryuji
Armstrong Westerman Hattori McLeland & Naughton LLP
Fujitsu Limited
Graybill David E.
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