Semiconductor device and mount structure thereof

Details Semiconductor device and mount structure thereof Semiconductor device and mount structure thereof

1996-08-16

1998-07-07

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257778, H01L 2348

Patent

active

057773866

ABSTRACT:
A semiconductor device includes a semiconductor element having first and second surfaces. The element has connecting terminals on the first surface. A substrate has a substrate surface on which external connecting terminals and conductive patterns are formed. The connecting terminals of the semiconductor element are electrically connected to the external connecting terminals by means of the conductive patterns. The connecting terminals of the semiconductor element are each connected to one end of respective ones of the conductive patterns of the substrate by a flip-chip bonding. Resin hermetically seals the connecting terminals of the semiconductor element, so that the second surface of the semiconductor element is not covered by the sealing resin. A mounting substrate has a surface provided with circuit patterns. The semiconductor device is mounted on the mounting substrate in such a manner that the external connecting terminals are electrically connected to the circuit patterns of the mounting substrate and the second surface of the semiconductor element comes into contact with the surface of the mounting substrate.

REFERENCES:
patent: 5155661 (1992-10-01), Nagesh et al.
patent: 5616958 (1997-04-01), Laine et al.

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