Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate
2006-11-15
2010-10-05
Pizarro, Marcos D. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
C257S787000, C257S678000, C257S100000, C257S433000, C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S065000, C438S066000, C438S067000, C438S127000, C438S124000, C438S126000
Reexamination Certificate
active
07808085
ABSTRACT:
A semiconductor device includes a pair of power chips, an IC chip, a plurality of leads one of which having a die pad on which the power chips are mounted and another one having a die attach portion on which the IC chip is mounted, a resin sheet firmly adhered to one side of the die pad, and a resin casing made by molding operation to encapsulate the power chips, the IC chip and the resin sheet by a resin in such a manner that one surface of the resin sheet opposite the die pad is exposed to the exterior of the resin casing. The resin casing has a groove formed in one surface opposite the exposed surface of the resin sheet, the groove extending parallel to the resin sheet and perpendicular to a runner through which the resin was supplied in the molding operation.
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Hayashi Ken-ichi
Kawafuji Hisashi
Nakagawa Shinya
Ozaki Hiroyuki
Buchanan & Ingersoll & Rooney PC
Mitsubishi Electric Corporation
Montalvo Eva Yan
Pizarro Marcos D.
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