Semiconductor device and module

Details Semiconductor device and module Semiconductor device and module

1995-04-04

1997-01-07

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257675, 257676, H01L 23495

Patent

active

055920195

ABSTRACT:
A semiconductor device in a vertical surface mount package, reduced in size and having a higher heat radiating capacity, a method of producing the semiconductor device, and a semiconductor module. Leads of a first lead frame and leads of a second lead frame are parallel to each other and at least a portion of the leads overlap leads of the other lead frame when geometrically projected on them. An inner lead may extend out from the semiconductor package or the back side of a die pad in the semiconductor package may be exposed. The invention allows more outer leads to be used and makes it possible to reduce the size of the semiconductor device and to achieve high density mounting.

REFERENCES:
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 5047837 (1991-09-01), Kitano et al.
patent: 5172214 (1992-12-01), Casto
patent: 5365106 (1994-11-01), Watanabe
Winkler et al., "Dense Packaging For High Speed Cache Memory (Fast Static RAM) And Main Memory (DRAM)", Motorola Inc. Technical Developments, vol. 18, Mar. 1993, pp. 28-31.
Nekki Electronics (No. 4) published Sep. 7, 1987, pp. 99-107.

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