Semiconductor device and methods of manufacturing...

Details Semiconductor device and methods of manufacturing... Semiconductor device and methods of manufacturing...

2011-01-11

2011-01-11

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

Reexamination Certificate

active

07868446

ABSTRACT:
This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip wherein the molded body comprises an array of recesses in a first surface of the molded body, first contact elements, and elastic elements in the recesses that connect the first contact elements with the molded body.

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Brunnbauer et al., Embedded Wafer Level Ball Grid Array (eWLB); 2006 Electronics Packaging Technology Conference, 1-4244-0665-X/06, IEEE, 2006 (pp. 1-5).

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