Semiconductor device and method therefor

Semiconductor device manufacturing: process – Direct application of electrical current – To alter conductivity of fuse or antifuse element

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438333, 438601, H01L 2900

Patent

active

061402125

ABSTRACT:
A semiconductor device (10) is formed to have multiple external connection pads (17, 18) for an active element (12). The multiple external connection pads (17, 18) are electrically connected together with a electrical link (19). After testing, the electrical link (19) is removed to disconnect the multiple external connection pads (17, 18) from each other.

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patent: 5780921 (1998-07-01), Mitsuishi

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