Semiconductor device and method of production

Fishing – trapping – and vermin destroying

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437 44, 437 57, 437192, 437200, 257371, 257384, 257413, H01L 21265

Patent

active

051908867

ABSTRACT:
A novel semiconductor device and method of production of such a device are provided. Both the N and P channels of the novel semiconductor device are formed by contact self-alignment, thereby permitting high speed operation and high density integration to be realized. The formation of the channels by contact self-alignment is accomplished by depositing a P type polysilicon layer on an N well region and an N type polysilicon layer on a P well region. A silicide layer is formed over both the P and N type polysilicon layers to form a polycide.

REFERENCES:
patent: 4333099 (1982-06-01), Tanguay et al.
patent: 4374700 (1983-02-01), Scott et al.
patent: 4382827 (1983-05-01), Romano-Moran et al.
patent: 4432132 (1984-02-01), Kinsbron et al.
patent: 4476482 (1984-10-01), Scott et al.
patent: 4477310 (1984-10-01), Park et al.
patent: 4528744 (1985-07-01), Shibata
patent: 4546535 (1985-10-01), Shepard
patent: 4577391 (1986-03-01), Hsia et al.
patent: 4613885 (1986-09-01), Haken
patent: 4616401 (1986-10-01), Takeuchi
patent: 4621412 (1986-11-01), Kobayashi et al.
patent: 4639274 (1987-01-01), Krishna
patent: 4654958 (1987-04-01), Baerg et al.
patent: 4682403 (1987-07-01), Hartmann et al.
patent: 4703552 (1987-11-01), Baldi et al.

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