Semiconductor device and method of producing the same

Details Semiconductor device and method of producing the same Semiconductor device and method of producing the same

1995-10-24

1998-06-30

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437214, 437217, 437219, 437220, H01L 2160

Patent

active

057733139

ABSTRACT:
A semiconductor device includes a semiconductor chip (11) having a top surface and a bottom surface, a plurality of leads (14) arranged under the bottom surface of the semiconductor chip (11), where the leads (14) have first ends (14a) electrically coupled to the semiconductor chip (11) and second ends which form external terminals (16) and each of the external terminals have a bottom surface, and a package (17, 31) encapsulating the semiconductor chip (11) and the leads (14) so that the bottom surface of each of the external terminals (16) is exposed at a bottom surface (17a, 31a) of the package (17, 31) and remaining portions of the leads (14) are embedded within the package (17, 31), where the package (17, 31) has a size which is approximately the same as that of the semiconductor chip (11) in a plan view viewed from above the top surface of the semiconductor chip (11).

REFERENCES:
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 5107325 (1992-04-01), Nakayoshi
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5172214 (1992-12-01), Casto
patent: 5304843 (1994-04-01), Takubo et al.
patent: 5363279 (1994-11-01), Cha

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