Semiconductor device and method of producing said semiconductor

Details Semiconductor device and method of producing said semiconductor Semiconductor device and method of producing said semiconductor

1997-02-04

1998-07-21

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438111, 438124, 438127, H01L 2160

Patent

active

057834636

ABSTRACT:
The present invention is premised on a semiconductor device in which one semiconductor chip is mounted on each of both faces of a die pad of a lead frame. The semiconductor chips are disposed such that the projected lines, on the die pad, of the corresponding sides of the semiconductor chips, intersect with each other at an angle of 45.degree.. The tips of inner leads are located in the sides of a virtual octagon formed by outwardly enlarging an octagon formed by connecting, to one another, the apexes of the semiconductor chips. The sides of the virtual octagon are respectively opposite to the sides of the semiconductor chips. The number of the inner leads of which tips are located in each of the sides of the virtual octagon, is the same as the number of bonding pads disposed at each of the sides of the semiconductor chips. The inner leads of which tips are located in each of the sides of the virtual octagon, are connected to the bonding pads at each of the sides of one of the first and second semiconductor chips.

REFERENCES:
patent: 5012323 (1991-04-01), Farnworth
patent: 5084753 (1992-01-01), Goida et al.
patent: 5126823 (1992-06-01), Otsuka et al.
patent: 5215940 (1993-06-01), Orcutt et al.
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5309017 (1994-05-01), Maruyama
patent: 5321204 (1994-06-01), Ko

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