Semiconductor device and method of producing a high contrast...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component

Reexamination Certificate

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C257SE23179

Reexamination Certificate

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07135356

ABSTRACT:
A seconductor device (50) includes a semiconductor die (20) having a first surface (14) for forming electronic circuitry. A coating layer (16) formed on a second surface (15) of the semiconductor die has a color that contrasts with the color of the semiconductor die. The coating layer is patterned to expose a portion of the second surface to reveal information pertaining to the semiconductor device. The coating layer is patterned by directing a radiation beam (30) such as a laser to selectively remove material from the coating layer.

REFERENCES:
patent: 5294812 (1994-03-01), Hashimoto et al.
patent: 5562993 (1996-10-01), Hotta
patent: 5644102 (1997-07-01), Rostoker
patent: 6113992 (2000-09-01), Corbett
patent: 6270712 (2001-08-01), Shoji et al.
patent: 2003/0080440 (2003-05-01), Miks et al.

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