Semiconductor device and method of packaging the same

Details Semiconductor device and method of packaging the same Semiconductor device and method of packaging the same

2007-10-09

2007-10-09

Potter, Roy Karl (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000

Reexamination Certificate

active

11536270

ABSTRACT:
Embodiments of the invention provide a semiconductor-chip mounting body, a semiconductor device including the mounting body, and a method of packaging the semiconductor device. According to some embodiments, when a semiconductor chip is mounted on the mounting body as a flip-chip type, an encapsulation process using an encapsulation resin is not required. In some embodiments, the mounting body includes a substrate formed of a polyimide film, a conductive pattern formed of copper, a protection layer pattern formed of PSR, and an adhesive pattern formed on the protection layer pattern. The adhesive pattern can be formed of an insulating material. A plurality of holes, into which a plurality of bumps formed on the semiconductor chip are inserted to be connected to the conductive pattern, are formed in the protection layer pattern and the adhesive pattern.

REFERENCES:
patent: 6300234 (2001-10-01), Flynn et al.
patent: 6794750 (2004-09-01), Matsuda
patent: 6936532 (2005-08-01), Sakaida
patent: 6972381 (2005-12-01), Hashimoto
patent: 7060528 (2006-06-01), Nishikawa et al.
patent: 9-97815 (1997-04-01), None
patent: 2002-0042486 (2002-06-01), None
English language abstract of Japanese Publication No. 9-97815.
English language abstract of Korean Publication No. 2002-0042486.

Affiliated with

Also associated with

Rating

Semiconductor device and method of packaging the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of packaging the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of packaging the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3866926