Semiconductor device manufacturing: process – Chemical etching – Altering etchability of substrate region by compositional or...
Reexamination Certificate
2008-03-31
2010-06-15
Smith, Bradley K (Department: 2894)
Semiconductor device manufacturing: process
Chemical etching
Altering etchability of substrate region by compositional or...
C438S689000
Reexamination Certificate
active
07737041
ABSTRACT:
A semiconductor device comprises a semiconductor layer including a plurality of paralleled linear straight sections extending in a first direction. The layer also includes a plurality of connecting sections each having a width in the first direction sufficient to form a wire-connectable contact therein and arranged to connect between adjacent ones of the straight sections in a second direction. The connecting sections have respective ends formed aligned with a first straight line parallel to the second direction.
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Aochi Hideaki
Kito Masaru
Okamura Takayuki
Kabushiki Kaisha Toshiba
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Payen Marvin
Smith Bradley K
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