Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-07-29
2010-02-09
Thai, Luan C (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S614000, C438S612000, C438S613000, C257SE23021, C257SE23023
Reexamination Certificate
active
07659142
ABSTRACT:
A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of the electrodes; a conductive foil provided at a given spacing from the surface on which the passivation film is formed; an external electrodes formed on the conductive foil; intermediate layer formed between the passivation film and the conductive foil to support the conductive foil; and wires electrically connecting the electrodes to the conductive foil; wherein a depression tapered in a direction from the conductive foil to the passivation film if formed under a part of the conductive foil that includes the connection with the external electrodes.
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Oliff & Berridg,e PLC
Seiko Epson Corporation
Thai Luan C
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