Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2007-12-27

2010-12-14

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S119000, C438S127000, C257SE21500, C257SE21502

Reexamination Certificate

active

07851263

ABSTRACT:
A method of manufacturing a semiconductor device including (1) providing a metal plate having an upper surface and a back surface, the metal plate including a plurality of lids disposed in matrix, which are defined by a first groove formed from the upper surface, (2) providing a ceramic sheet having an upper surface and a back surface, the ceramic sheet including a plurality of headers disposed in matrix, which are defined by a second groove formed from the back surface, (3) fixing the metal plate on the ceramic sheet by facing the back surface of the metal plate to the upper surface of the ceramic sheet, wherein the first groove is aligned with the second groove, and (4) dividing the metal plate and the ceramic sheet along the first and the second grooves.

REFERENCES:
patent: 6627987 (2003-09-01), Glenn et al.
patent: 2003/0127428 (2003-07-01), Fujii et al.
patent: 2005/0260797 (2005-11-01), Farrell et al.
patent: 2006/0216955 (2006-09-01), Swenson et al.
patent: 2006-179740 (1999-11-01), None
JP 2006-179740 A machine translation.

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