Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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Details

C257S784000, C257S786000, C257SE23015

Reexamination Certificate

active

07825518

ABSTRACT:
A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion.

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patent: 2005/0139371 (2005-06-01), Ishimaru et al.
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patent: 2005-310815 (2005-11-01), None
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patent: 2005-353983 (2005-12-01), None

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