Semiconductor device and method of manufacturing the same

Electricity: electrothermally or thermally actuated switches – Electrothermally actuated switches – Fusible element actuated

Reexamination Certificate

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Details

C337S401000, C337S416000, C257S209000, C257S529000

Reexamination Certificate

active

07489230

ABSTRACT:
A semiconductor device includes a first insulating layer, which is formed on a semiconductor substrate (not shown), and formed with a concave portion, and an electric fuse which has a conductive member, a first terminal provided on one end and a second terminal provided on the other end of the conductive member, and which is provided on the first insulating layer. The first insulating layer is embedded with the conductive member. The conductive member has a flowing-out region in which a material forming the conductive member flows out to the outside of the concave portion, and is cut at a location different from the flowing-out region.

REFERENCES:
patent: 4814853 (1989-03-01), Uchida
patent: 4910418 (1990-03-01), Graham et al.
patent: 5949323 (1999-09-01), Huggins et al.
patent: 6008716 (1999-12-01), Kokubun
patent: 6225652 (2001-05-01), Devanney
patent: 6566730 (2003-05-01), Giust et al.
patent: 6661330 (2003-12-01), Young
patent: 6731005 (2004-05-01), Koyama et al.
patent: 7282751 (2007-10-01), Ueda
patent: 2005-39220 (2005-02-01), None
patent: 2005-57186 (2005-03-01), None

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