Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2007-09-25

2009-11-24

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S666000, C257S774000, C257S669000, C257S671000, C257S678000, C257S787000, C257SE29120, C257SE29127, C257SE23039, C257SE23079, C257SE23088, C257SE23092, C257SE23135

Reexamination Certificate

active

07622804

ABSTRACT:
Provided is a semiconductor device including a semiconductor chip, a film (first film) which is provided so as to cover an active region with a peripheral portion of the semiconductor chip being uncovered, and is made of a dielectric material having a low dielectric constant, and a package molding resin (sealing resin) provided so as to cover the semiconductor chip and the film. As a result, deterioration in contact property with the sealing resin is suppressed and a high frequency characteristic can be enhanced.

REFERENCES:
patent: 6046506 (2000-04-01), Hikita et al.
patent: 6222260 (2001-04-01), Liang et al.
patent: 2002/0068379 (2002-06-01), Cobbley et al.
patent: 2007/0085177 (2007-04-01), Loo et al.
patent: 2007/0132089 (2007-06-01), Jiang et al.
patent: 5-136312 (1993-06-01), None
patent: 9-8181 (1997-01-01), None
patent: 2003-133512 (2003-05-01), None

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