Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1997-03-20
1998-07-21
Niebling, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438123, 257717, H01L 2160
Patent
active
057834660
ABSTRACT:
A semiconductor device according to the present invention includes a substrate made of an electrically insulative material having a relatively high thermal conductivity, a metallic pattern member provided on one major surface of the substrate and having an external terminal portion extending from the substrate, a semiconductor element mounted on the metallic pattern member, a metallic layer provided on the other major surface of the substrate, a heat dissipation plate fixed onto the metallic layer, and a mold body for coating both the substrate mounted with the semiconductor element and the heat dissipation plate so as to expose the external terminal portion. A method for manufacturing a semiconductor device according to the present invention includes a step of mounting a semiconductor element on a metallic pattern member provided on one major surface of a substrate made of an electrically insulative material having a relatively high thermal conductivity, the substrate having a metallic layer on the other major surface thereof, a step of fixing a heat dissipation plate onto the metallic layer, and a step of coating both the substrate mounted with the semiconductor element and the heat dissipation plate with an insulative material so as to expose the external terminal portion.
REFERENCES:
patent: 3829598 (1974-08-01), Darnell
patent: 4129243 (1978-12-01), Cusano et al.
patent: 5317194 (1994-05-01), Sako
Dousen Noriaki
Sato Nobuyuki
Takahashi Wataru
Kabushiki Kaisha Toshiba
Niebling John
Turner Kevin F.
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