Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-12-13
2008-11-04
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S118000, C438S125000
Reexamination Certificate
active
07445964
ABSTRACT:
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
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Jobetto Hiroyasu
Kageyama Nobuyuki
Kido Toshihiro
Kohno Daita
Mihara Ichiro
Barnes Seth
Casio Computer Co. Ltd.
CMK Corporation
Frishauf Holtz Goodman & Chick P.C.
Smith Zandra
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