Semiconductor device and method of manufacturing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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C438S118000, C438S125000

Reexamination Certificate

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07445964

ABSTRACT:
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.

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patent: 6467674 (2002-10-01), Mihara
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patent: 6657295 (2003-12-01), Araki
patent: 6749927 (2004-06-01), Cooray
patent: 6882054 (2005-04-01), Jobetto
patent: 2002/0038890 (2002-04-01), Ohuchi
patent: 2005/0146051 (2005-07-01), Jobetto
patent: 11-233678 (1999-08-01), None
patent: 2001-326299 (2001-11-01), None
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patent: 2002-084074 (2002-03-01), None
patent: 2002-246755 (2002-08-01), None
patent: 2002-246756 (2002-08-01), None
patent: 2003-231854 (2002-08-01), None

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