Semiconductor device and method of manufacturing the same

Fishing – trapping – and vermin destroying

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437195, H01L 2144, H01L 2148

Patent

active

051067803

ABSTRACT:
The present invention provides a semiconductor device, comprising a substrate, a first insulation layer formed on the substrate, a first wiring layer formed on the first insulation layer, a second insulation layer formed on the first wiring layer and having a contact hole, and a third insulation layer formed on the second insulation layer, said third insulation layer being in contact with the first wiring layer via the contact hole.

REFERENCES:
patent: 4647850 (1987-03-01), Henderson et al.
patent: 4656732 (1987-04-01), Teng et al.
patent: 4737831 (1988-04-01), Iwai
patent: 4900695 (1990-02-01), Takahashi et al.

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