Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

1990-06-12

1991-01-22

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 68, 174 524, H01L 2348, H01L 2328, H01L 2948, H02G 1308

Patent

active

049874748

ABSTRACT:
In a tabless lead frame wherein a space for laying inner leads is sufficiently secured when a lengthened and enlarged semiconductor pellet is placed or set in a resin-molding package, through holes are provided in leads for the purpose of increasing the occupation area ratio of a resin portion. Furthermore, each of the leads corresponding to the lower surface of the pellet is branched into a plurality of portions in the widthwise direction thereof in order to reduce a stress. Further, in an insulating sheet which is interposed between the leads and the pellet, the dimension of the shorter lateral sides thereof is set smaller than that of the shorter lateral sides of the pellet in order to prevent cracks from occurring at the end part of the insulating sheet.

REFERENCES:
patent: 3781457 (1973-12-01), McKerreghan
patent: 4445271 (1984-05-01), Grabbe

Affiliated with

Also associated with

Rating

Semiconductor device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1558038