Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Reexamination Certificate
2007-10-02
2007-10-02
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Electrical characteristic sensed
C438S614000, C438S653000, C438S654000, C438S656000, C438S674000, C438S686000
Reexamination Certificate
active
10914235
ABSTRACT:
A method of manufacturing a semiconductor device includes the steps of forming barrier metals on first electrodes provided on a chip of the semiconductor device, implementing a predetermined test on the semiconductor device by applying a signal to the semiconductor device via at least one of the barrier metals, and forming second protruded electrodes on the barrier metals. The predetermined tests are implemented before forming second protruded electrodes on the barrier metals.
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Miyata Katsumi
Watanabe Eiji
Yoda Hiroyuki
Fujitsu Limited
Graybill David E.
Westerman, Hattori, Daniels & Adrian , LLP.
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