Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2007-07-17

2007-07-17

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S612000, C438S613000, C438S694000, C438S692000, C438S459000, C438S202000, C257S643000, C257S645000, C257S673000, C257S741000, C257SE21088, C257SE21512

Reexamination Certificate

active

10761081

ABSTRACT:
There are included a semiconductor substrate provided with a desirable element region, an electrode pad formed to come in contact with a surface of the semiconductor substrate or a wiring layer provided on the surface of the semiconductor substrate, a bonding pad formed on a surface of the electrode pad through an intermediate layer, and a resin insulating film for covering a peripheral edge of the bonding pad such that an interface of the bonding pad and the intermediate layer is not exposed to a side wall.

REFERENCES:
patent: 4914057 (1990-04-01), Gloton
patent: 5567981 (1996-10-01), Bhansali et al.
patent: 2002/0022301 (2002-02-01), Kwon et al.
patent: 2003/0013291 (2003-01-01), Chen et al.
patent: 2003/0034550 (2003-02-01), Nakatani
patent: 57-106140 (1982-07-01), None
patent: 3-16145 (1991-01-01), None
patent: 6-196526 (1994-07-01), None
patent: 11-40601 (1999-02-01), None
patent: 2000-40773 (2000-02-01), None

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