Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2007-03-20

2007-03-20

Ho, Tu-Tu (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S462000, C257S620000, C257SE21700

Reexamination Certificate

active

11043355

ABSTRACT:
A semiconductor device includes at least one semiconductor structure having a plurality of external connection portions on an upper surface, and an insulating member which is made of a resin containing reinforcing materials and arranged on a side of the semiconductor structure. An insulating film is formed on the upper surface of the semiconductor structure, except the external connection portions, and on an upper surface of the insulating member. A plurality of upper wirings each of which has a connection pad portion are located on an upper side of the insulating film and electrically connected to a corresponding one of the external connection portions of the semiconductor structure. The connection pad portion of at least one of the upper wirings is arranged above an upper surface of the insulating member.

REFERENCES:
patent: 6467674 (2002-10-01), Mihara
patent: 6486005 (2002-11-01), Kim
patent: 6657295 (2003-12-01), Araki
patent: 6749927 (2004-06-01), Cooray
patent: 2002/0038890 (2002-04-01), Ohuchi
patent: 2005/0051886 (2005-03-01), Mihara et al.
patent: 11-233678 (1999-08-01), None
patent: 2001-326299 (2001-11-01), None
patent: 2001-332643 (2001-11-01), None
patent: 2002-016173 (2002-01-01), None
patent: 2002-084074 (2002-03-01), None
patent: 2002-231854 (2002-08-01), None
patent: 2002-246755 (2002-08-01), None
patent: 2002-246756 (2002-08-01), None
patent: 2002246756 (2002-08-01), None

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