Semiconductor device and method of manufacturing the same,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

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C257SE23022, C257S780000, C257S737000, C257S738000, C438S612000

Reexamination Certificate

active

10880352

ABSTRACT:
A semiconductor device includes: a semiconductor substrate in which an integrated circuit is formed; an interconnect layer which includes a linear section and a land section connected with the linear section; and an underlayer disposed under the interconnect layer, and the land section includes a first section which is in contact with the underlayer, and a second section which is not in contact with the underlayer.

REFERENCES:
patent: 5656858 (1997-08-01), Kondo et al.
patent: 5757078 (1998-05-01), Matsuda et al.
patent: 5874782 (1999-02-01), Palagonia
patent: 6181010 (2001-01-01), Nozawa
patent: 6181569 (2001-01-01), Chakravorty
patent: 6229221 (2001-05-01), Kloen et al.
patent: 6255737 (2001-07-01), Hashimoto
patent: 6465886 (2002-10-01), Horiuchi et al.
patent: 6555459 (2003-04-01), Tokushige et al.
patent: 6586275 (2003-07-01), Kim et al.
patent: 6621154 (2003-09-01), Satoh et al.
patent: 6790759 (2004-09-01), Wang et al.
patent: 6841875 (2005-01-01), Ohsumi
patent: 2002/0070440 (2002-06-01), Aiba et al.
patent: 55-074159 (1980-06-01), None
patent: 01-161735 (1989-06-01), None
patent: 11-008250 (1999-01-01), None
patent: 2000-114299 (2000-04-01), None
patent: 2002-237546 (2002-08-01), None

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