Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-03-13
2007-03-13
Wilczewski, M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S778000, C257S779000, C257S780000
Reexamination Certificate
active
10962157
ABSTRACT:
A semiconductor device is provided that comprises: a first semiconductor package including a first substrate having a first pad; a second semiconductor package including a second substrate having a second pad which is mounted on the first semiconductor package; and solder provided between the first and second substrates that electrically couples each of the first pads and each of the second pads. Only the solder at the corner portions of the first substrate is covered with resin.
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Communication from Japanese patent Office re: related application.
Seiko Epson Corporation
Thomas Toniae M.
Wilczewski M.
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