Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate
2006-08-29
2006-08-29
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
C438S427000, C438S426000, C438S435000, C438S221000, C438S701000
Reexamination Certificate
active
07098115
ABSTRACT:
Hexachlorodisilane (Si2Cl6) is used as a Si raw material for forming a silicon nitride film that can be widely different in the etching rate from a silicon oxide film. The silicon nitride film is formed by an LPCVD method.
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Saida Shigehiko
Tanaka Masayuki
Tsunashima Yoshitaka
Anya Igwe U.
Baumeister B. William
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
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